brief introduction

The preparation process of silicon wafer starts from silicon single crystal rod to clean polishing wafer, so that it can be used in excellent environment. During this period, there are many processes and cleaning steps from one monocrystalline silicon rod to several silicon wafers that can meet special requirements. In addition to many process steps, the whole process is almost carried out in a dust-free environment. The processing of silicon wafers starts from a relatively dirty environment and ends in a level 10 clearance room.

Process Overview

The silicon wafer processing process includes many steps. All steps can be summarized into three main categories: they can correct physical properties, such as size, shape, flatness, or the properties of some bulk materials; It can reduce the number of undesired surface damage; Or it can eliminate surface contamination and particles. The main steps of silicon wafer processing are shown in the typical process in Table 1.1. The sequence of process steps is very important because the decision of these steps can make the silicon wafer suffer as little damage as possible and reduce the contamination of the silicon wafer. Each step will be described in detail in the following chapters.

Table 1.1 silicon wafer processing steps

1. Slice

2. Laser marking

3. Chamfer

4. Grinding disc

5. Corrosion

6. Back injury

7. Edge mirror polishing

8. Preheating and cleaning

9. Resistance to stability - annealing

10. Back seal

11. Adhesive sheet

12. Polishing

13. Cleaning before inspection

14. Appearance inspection

15. Metal cleaning

16. Wiper blade

17. Laser inspection

18. Packing / shipping