Main cutting chips, silicon (polished chip /SiO2/SOI/EPI/Pattern/ plated metal), LED substrate, PCB board, glass, ceramics, sapphire,

* Square size from 1mm to 210mm, high precision, no dust particle contamination, does not affect the performance and use effect of the silicon chip itself,

* Y step accuracy can reach 0.1µm, Z step accuracy is 1µm,

* Grinding thinning can be reduced to a thin thickness of 50µm, accuracy of 3-5 µm.