Silicon Wafer on insulating substrate (SOI Wafer): mainly used in MEMS and advanced CMOS integrated circuit diffusion process. SOI silicon wafer SOI material has incomparable advantages: it can achieve dielectric isolation of devices in integrated circuits and completely eliminate parasitic latch effect in silicon CMOS circuits; The integrated circuit made of this material also has the advantages of small parasitic capacitance, high integrated density, fast speed, simple process, small short channel effect and especially suitable for low voltage and low power circuits.

The SOI silicon chip consists of three layers of material splashes: the top Device Layer, the middle BOX Layer and the bottom Handle Layer.

SOI silicon wafers are typically made to a unique specification for different end applications. New Micron offers SOI wafers in various sizes and specifications, such as 100mm, 150mm and 200mm.