How many chips can a silicon chip be cut -- ranking of the world's top 10 wafer foundry revenue

How many wafers can be cut out of a silicon wafer?

This depends on the size of your die, wafer and yield.

At present, the so-called 6-inch, 12 inch or 18 inch wafer in the industry is actually the abbreviation of wafer diameter, but this inch is an estimated value. In fact, the wafer diameter is divided into 150 mm, 300 mm and 450 mm, and 12 inch is about 305 mm. For convenience, it is called 12 inch wafer.

The calculation formula commonly used by FAB factory in the world:

Smart readers must have found that the square of π * (wafer diameter / 2) in the formula is not the formula of circle area? If the formula is simplified again, it will become:

X is the so-called DPW die per wafer.

It's time to test your computing ability!

Assuming that each 12 inch wafer costs US $5000, then the wafer size of NVIDIA Xinli GT200 is 576 square mm. Under the condition of 50% yield, what is the average cost per wafer?

Answer: USD eighty-seven point seven two

Popular science: the difference between wafer die chip

Let's start with a complete wafer:

A complete wafer

Wafer is the wafer shown in the picture, which is composed of pure silicon (SI). It is generally divided into 6-inch, 8-inch and 12 inch specifications. The wafer is produced based on this wafer. A small piece on wafer is a wafer, which is called die. After packaging, it becomes a particle. A wafer containing NAND flash wafers. Wafers are first cut and then tested. The intact, stable and full capacity die is removed and packaged to form the NAND flash chip seen in daily life. Then, the remaining on the wafer is either unstable, partially damaged, so the capacity is insufficient, or completely damaged. Considering the quality assurance, the original factory will declare this die dead, which is strictly defined as the scrapping of all waste products.